Silicone heat transfer compound. Operating temperature range of -40 to 200°C. Thermal conductivity of 0.7 W/(m∙K)
  • Manufacturer:
  • Model:
    860
  • SKU:
  • Available:
    1 pcs.

7.81 zł (Brutto: 6.35 zł)
In stock

Silicone Heat Transfer Compound 860 MG Chemicals

860 MG Chemicals is a CPU heat sink compound. Our thermal paste designed to reduce thermal resistance between irregular metal surfaces. Coupled with reasonable thermal conductivity, 860 MG Chemicals has a soft consistency and a wide operating temperature range, which in some instances makes it the best thermal paste for CPU applications.
This silicone-based PC thermal paste is mostly used to improve heat flow between heat sinks and heat-generating components, such as CPUs, GPUs, LEDs, motors, and power components.

For a silicone-free thermal paste, try 8616 MG Chemicals.
We also offer electrically conductive greases, dielectric greases, and lubricating greases.

Features & Benefits
  •     Thermal conductivity of 0.7 W/(m·K)
  •     High dielectric strength
  •     Broad service temperature range of -40 to 200 °C (-40 to 392 °F)
  •     Excellent corrosion resistance
  •     Non-bleeding heat transfer paste
  •     Non-electrically conductive
  •     Long service life


You watched

Slow Cure Thermally Conductive Adhesive 8329TCS MG Chemicals

Slow Cure Thermally Conductive Adhesive 8329TCS MG Chemicals

Thermal conductivity of 1.4 W/(m.K), 4 hours working time. Non-sagging paste, NASA low outgassing approved, Heat cure only.
Brand:MG Chemicals
122.31 zł
Thermally Conductive 1-Part Epoxy Adhesive 9460TC
Pre-Order

Thermally Conductive 1-Part Epoxy Adhesive 9460TC

Thermal conductivity of 0.8 W/(m·K), unlimited working time. It does not require frozen storage and reduces manufacturing cost by eliminating mixing process of epoxy resin and hardener. Heat cure only.
Brand:MG Chemicals
49.22 zł