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MG Chemicals offers a wide range of epoxy potting compounds for protecting printed circuit boards and electronic devices. These epoxy formulations provide superior protection against water, chemical, mechanical, thermal, and electrical shock. Our epoxy potting compound portfolio includes many functional specialties including flame retardancy, thermal conductivity, optical clarity, and dimensional stability.
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Thermal Gap Filler, Silicone 8327GF41 MG Chemicals
8327GF41 MG Chemicals is a two-component, flame retardant, thermally conductive silicone gap filler. It is a smooth, non-sagging paste that stays firmly in place after being dispensed. The cured product creates a thermal path that efficiently dissipates heat from electronic devices.
Brand:MG Chemicals0
One-part Epoxy, Electrically Conductive Adhesive, High Tg 9410 MG Chemicals
Resistivity of 1.8 x 10ˉ³ Ω·cm, glass transition temp (Tg) of 96 °C, unlimited working time. It does not require frozen storage and reduces manufacturing cost by eliminating mixing process of epoxy resin and hardener. Heat cure only, cures in 1 hour at 90 °C.
Brand:MG Chemicals0
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