Medium Cure Thermal Conductive Adhesive 8329TCM MG Chemicals
Not available
Thermal conductivity of 1.4 W/(m·K), 45 minute working time. Non-sagging paste. Can be cured at room temperature or higher.
  • Manufacturer:
    MG Chemicals
  • Model:
    8329TCM
  • SKU:
  • Available:
    Not available
228.75 zł (Brutto: 185.98 zł)
Not available

Medium Cure Thermal Conductive Adhesive 8329TCM MG Chemicals

8329TCM MG Chemicals is a thermally conductive two-part epoxy adhesive. It is dark grey, smooth, viscous, thixotropic, and bonds well to a wide variety of substrates.

This product is used to bond heat sinks, LEDs, and other heat-generating components in electronic assemblies.

8329TCM has been designed for maximum thermal conductivity with a high viscosity. For a lower viscosity, use 8329TFM MG Chemicals. For a faster working life, use 8329TCF MG Chemicals. For a longer working life, use 8329TCS MG Chemicals.

Features and Benefits

  •     Thermal conductivity of 1.4 W/(m·K)
  •     1:1 mix ratio
  •     Working life: 45 minutes
  •     Cure time: 24 hours room temperature or 1 hour at 65 °C (149 °F)
  •     Provides strong electrical insulation
  •     High tensile and compressive strength
  •     Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons
  •     Shelf life: ≥3 years
  •     RoHS 3 compliant

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